展商名称：杭州地芯科技有限公司

英文名称：Hangzhou Geo-chip Technology Co., Ltd.

展位号：3C67

产品/技术：聚焦高性能模拟射频芯片：射频前端芯片、射频收发机芯片和模拟信号链芯片。

应用领域：应用场景覆盖无线通信、消费电子、工业控制、医疗器械等多种领域。

公司地址：浙江省杭州市余杭区文一西路1818-2号1号楼808室

公司介绍：

地芯科技成立于2018年，总部位于杭州 ，并在上海及深圳设有分部，专注模拟和射频集成电路研发，致力于成为全球领先的高端模拟射频芯片设计和提供者。
目前已形成射频收发机、射频前端和模拟信号链三大产品线，成功量产包括地芯风行在内的数十款高端模拟射频芯片，并大批量应用于无线通信、工业电子及物联网等诸多领域。与利尔达、佰才邦等行业头部企业达成战略合作，现有股东包括集成电路行业知名上市公司及著名投资机构。

英文介绍：

Hangzhou Geo-chip Technology Co., Ltd. founded in 2018, is headquartered in The Artificial intelligence town of Hangzhou, China, and has branches in Shanghai and Shenzhen.
The company focuses on the research and development of analog and RF integrated circuits, with complete R&D and mass production capabilities, committed to becoming a leading global provider of high-end analog RF chip design. After nearly 5 years of development, the GEO-Chip has formed three major product lines: RF transceivers, RF front-end, and analog signal chains, with product applications in various fields such as wireless communication, industrial electronics and the Internet of Things.
The company has successively been recognized as a national high-tech enterprise, a technology-based small and medium-sized enterprise in Zhejiang Province and a research and development center for enterprises in Hangzhou. R&D technicians account for nearly 70% of the company's total workforce, with over 80% holding master's and doctoral degrees. They have graduated from prestigious universities at home and abroad such as Tsinghua University, Zhejiang University, University of California, Los Angeles, National University of Singapore, and have worked in leading semiconductor companies such as Qualcomm, MediaTek, Samsung, and TI. They generally have 10-20 years of experience in chip R&D and mass production, and their majors comprehensively cover systems, RF, analog, digital, algorithms, software testing, application, layout, and other directions.
The company has reached strategic cooperation with leading enterprises in the industry such as Lierda and Baiceils, and has completed a cumulative financing of hundreds of millions of yuan. Its existing shareholders include well-known listed companies in the integrated circuit industry and nationally renowned investment institutions.