时间:2024年4月24-26日 上海世博展览馆-北门(博成路)
距离展会开幕
北京智联安科技有限公司
Beijing Mlink Technology Inc
10C31
北京市海淀区北四环西路9号楼8层808
http://www.mlink-tech.cn
北京智联安科技有限公司由清华校友吕悦川、钱炜先生于2013年9月在北京创办,十年来坚持通信芯片核心技术全部自研的技术路线,在过去4年内已陆续推出NB-IoT、LTE Cat.1bis、5G RedCap定位芯片等重量级产品,市场表现出色。团队成员来自高通、华为、展锐、爱立信等国际国内知名通信芯片及设备公司,平均从业年限超15年。公司致力于研发最优秀的广域蜂窝物联网通信芯片。
Beijing MLINK Technology Inc. was founded by Tsinghua alumni Lv Yuechuan and Qian Wei in Beijing in September 2013. In ten years, it adhered to the technical route of independent innovation of core technologies. In the past four years, it has successively launched NB-IoT, LTE Cat.1bis, 5G RedCap positioning chips and other heavyweight products, with outstanding market performance. The team members from well-known international and domestic communication chip and equipment companies, such as Qualcomm, Huawei, UNISOC, Ericsson, with an average industry experience of more than 15 years. The company is committed to developing the best wide-area cellular IoT communication chip.
展商邀请函